Every day, we get more news concerning the features of the upcoming flagship, namely the Redmi K30 Pro. Every day, we learn about at least 4-5 features it will come. And every day, we understand this handset is full of technology. Today is no exception.
Redmi K30 Pro Hardware
First, the Redmi K30 Pro will come with Super Bluetooth + Bluetooth 5.1. Super Bluetooth can effectively expand the range of Bluetooth signals. And it can still stay connected for 400 meters. And Bluetooth 5.1 can provide lower latency when you connect Bluetooth speakers to listen to music or play games, there is no longer the problem of audio and video out of sync.
Second, the Redmi K30 Pro 5GHIA is equipped with dual-mode 5G + Multilink three-way parallel technology. Thus, at the same time, it can connect 2.4GHz Wi-Fi, 5GHz Wi-Fi 6, and 4G / 5G mobile networks. Three parallel connections will always maintain high-speed download and stable connectivity.
Third, Lu Weibing said: ‘The layout of internal devices is small, and there are not many devices, with about 61 components arranged per square centimeter.’
From the picture, the quad-camera module of the Redmi K30 Pro and the lifting structure of the front lens occupies a large area. However, thanks to the dense component arrangement and high integration, a reasonable layout is still achieved.
Components and Motherboard
Earlier, Lu Weibing said that the reason why punch-hole screens had become the mainstream of 5G smartphones is that the pop-up design is too difficult to use.
For example, he said that the number of 5G smartphone components has increased significantly. Taking Redmi K30 Pro as an example, the number of components is as high as 3885. This is an increase of 268% over the previous generation K20 Pro. It is more difficult to fabricate.
Under the premise of the proliferation of components, front pop-up and rear-centered design pose great challenges to the motherboard design. Originally, the entire motherboard was divided into two “big pits”, which led to a significant reduction in motherboard utilization.
It is reported that the pop-up design of the Redmi K30 Pro can withstand the test of 300,000 bounces, and it can take more than 4 years to take 100 selfies per day.
In addition, the Redmi K30 Pro adopts a middle-frame integrated rail design, physical protection of spring devices, dual magnet + hall calibration chip pressing protection, and also optimizes the spiral stepping motor. This improves the previous generation of 120ms drop protection recovery induction speed by 17%.
Fourth, The K30 Pro uses a very difficult ‘sandwich’ structure motherboard, as if there is an extra layer on the motherboard.
The ‘sandwich’ structure is composed of three layers of radiofrequency board, adapter board, and mainboard, and adopts a highly integrated arrangement. For Redmi, this is a challenge and another breakthrough in technology.
The motherboard is thicker, the thickness of the fuselage should also increase, and the weight of the pop-up camera phone is already more prominent.
At last, Lu Weibing replied to those who had been concerned whether there are new announcements at the conference if the company reveals tons of its features ahead of launch. He said: ‘Don’t worry about the Redmi K30 Pro, as if there is nothing to say at the press conference … be ready to urinate.’
Redmi K30 Pro will be officially released on March 24. It should be priced at 3299 yuan ($466).